Tag Archives: ThreeDimensional
SelectConnect Technologies and Val Tech Group Partner To Provide Three-Dimensional Molded Interconnect Device Solutions
Palatine, IL (PRWEB) December 30, 2011 SelectConnect Technologies, Palatine, Illinois and The Val Tech Group, Rochester, New York have partnered together to provide three-dimensional molded interconnect device (3D-MID) solutions. 3D-MID are alternatives for flex circuits, circuit boards, wiring and connectors … Continue reading
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Tagged Device, group, Interconnect, Molded, Partner, Provide, SelectConnect, Solutions, tech, Technologies, ThreeDimensional
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